Flexible Printed Circuit Manufacturer

MATERIALS
CAP

Listed below are FPCexpress standard materials and specifications for Flexible Printed Circuits (FPC). These serve only as guidelines. Contact FPCexpress for special flex circuit materials, tighter tolerances, and any other exceptions that arise in your application.

MATERIALS

This table lists the standard flex circuits materials and material thicknesses that FPCexpress may have daily available.  If the material or thickness you require is not listed, consult FPCexpress. We have full specification of each material available for your required.

Material Function

Material Type

Options

Flexible Insulator

Polyimide (PI)

½ mil to 5 mil

Conductor

Copper

* Rolled Annealed (RA)

* Electrodeposited (ED)

¼ oz. (0.009 mm)

to 10 oz. (0.356 mm)

Rigid Substrate (Rigid-Flex)

FR-4

3 mil to 125 mil

Adhesive

Acrylic Adhesive

½ mil to 3 mil

Adhesiveless Materials also available.

Stiffener

FR-4

Polyimide (PI)

Polyester (PET)

Adhesive Tape

Steel / Aluminium / Copper

3 mil to 125 mil

½ mil to 5 mil

1 mil to 15 mil

6 mil

Solder Mask

Polyimide

Photoimageable Coverlay

Liquid Photoimageable Covercoat

½ mil to 5 mil

1  mil to 2.5 mil

Liquid Typically for Surface Mount and Dense applications

Surface Finish Options

Tin

Immersion Tin

Gold

Electroless Nickel Immersion Gold

Electrolytic Hard Nickel/Gold

Electrolytic Soft Nickel/Gold

Silver

Immersion

OSP

Organic Solderability Preservative

Shielding

Solid Copper

Crosshatched Copper

Conductive Silver

Aluminium

Required to Limit Electromagnetic and/or Electrostatic.

CAPABILITIES AND PHYSICAL PROPERTIES

Layers (Max)

Up to 8 Layers

Board Size (Max)

Up to 500 mm x 1000 mm

Outline Tolerance

a. +/- 0.2 mm Hand Trim

b. +/- 0.25 mm Steel Rule Dies

c. +/- 0.07 mm Punch and Die

d. +/- 0.025 mm Laser Cut

Hole

Diameter (Min)

0.1 mm (Finished)

Diameter Tolerance

a. Plating Through Holes
   +/- 0.08 mm

b. Non-Plating Through Holes
    +/- 0.05 mm

Drill Position Tolerance

+/- 0.076 mm

Conductor

Width (Min)

1.5 mil

Width Tolerance

+/- 15%

Spacing (Min)

2 mil

Spacing Tolerance

+/- 15%

Pad

Pad (Non-Wiring)

≥ 0.4 mm + Hole

Pad (Wiring)

≥ 0.3 mm + Hole

Coverlay

Distance from Holes in Coverlay to Conductors and/or borders (Min)

≥ 0.13 mm

Coverlay to Pad (Min)

100 um

Coverlay to Conductor (Min)

100 um

Coverlay Width (Min)

250 um

Stiffener holes

≥ 0.25 mm + Access Hole

VALUE ADD SERVICE

Turn Key Solutions

Assembly

Hand Placement and Soldering

SMT

Reflow

Wave Solder

Lead Time

NORMAL LEAD TIME

Prototype

Single Sided or Double Sided

2 ~ 14 days

Multilayer

7 ~ 21 days

Production

First Order

5 ~ 12 days

Ongoing Order

3 ~ 10 days


Copyright © FPCexpress.com All rights reserved.