Capabilities
Flex Circuit Capabilities
Our standard materials, tolerances and specifications for flexible printed circuits. These are guidelines: contact us for special materials, tighter tolerances or anything else your application needs.
8 layersmaximum layer count
500 × 1000 mmmaximum board size
1.5 / 2 milminimum line width / spacing
±0.025 mmoutline tolerance, laser cut
Materials
The standard flex circuit materials and thicknesses we keep available. If the material or thickness you need isn't listed, ask us: we have full specifications for every material we offer.
| Material function | Material type | Options |
|---|---|---|
| Flexible insulator | Polyimide (PI) | ½ mil to 5 mil |
| Conductor | Copper
| ¼ oz (0.009 mm) to 10 oz (0.356 mm) |
| Rigid substrate (rigid-flex) | FR-4 | 3 mil to 125 mil |
| Adhesive | Acrylic adhesive Adhesiveless materials also available | ½ mil to 3 mil |
| Stiffener | FR-4 | 3 mil to 125 mil |
| Polyimide (PI) | ½ mil to 5 mil | |
| Polyester (PET) | 1 mil to 15 mil | |
| Adhesive tape | 6 mil | |
| Steel / aluminium / copper | Contact us | |
| Solder mask | Polyimide coverlay | ½ mil to 5 mil |
| Photoimageable coverlay | 1 mil to 2.5 mil | |
| Liquid photoimageable covercoat | Typically for surface mount and dense designs | |
| Surface finish | Tin | Immersion tin |
| Gold | Electroless nickel immersion gold (ENIG) | |
| Electrolytic hard nickel/gold | ||
| Electrolytic soft nickel/gold | ||
| Silver | Immersion silver | |
| OSP | Organic solderability preservative | |
| Shielding | Solid copper Crosshatched copper Conductive silver Aluminium | Used to limit electromagnetic and/or electrostatic interference |
Typical multilayer flex circuit construction
Capabilities and physical properties
| Feature | Capability | |
|---|---|---|
| Layers (max) | Up to 8 layers | |
| Board size (max) | Up to 500 mm × 1000 mm | |
| Outline tolerance | ±0.2 mm hand trim ±0.25 mm steel rule die ±0.07 mm punch and die ±0.025 mm laser cut | |
| Holes | Diameter (min) | 0.1 mm (finished) |
| Diameter tolerance | ±0.08 mm plated through holes ±0.05 mm non-plated through holes | |
| Drill position tolerance | ±0.076 mm | |
| Conductors | Width (min) | 1.5 mil |
| Width tolerance | ±15% | |
| Spacing (min) | 2 mil | |
| Spacing tolerance | ±15% | |
| Pads | Non-wiring pad | ≥ 0.4 mm + hole |
| Wiring pad | ≥ 0.3 mm + hole | |
| Coverlay | Coverlay opening to conductors and/or borders (min) | ≥ 0.13 mm |
| Coverlay to pad (min) | 100 µm | |
| Coverlay to conductor (min) | 100 µm | |
| Coverlay width (min) | 250 µm | |
| Stiffener holes | ≥ 0.25 mm + access hole | |
Value-added services
We offer complete turnkey solutions, so your flex circuits arrive ready to install.
- Hand placement and soldering
- SMT assembly
- Reflow soldering
- Wave soldering
Normal lead time
| Prototype | Single or double sided | 3–14 days |
|---|---|---|
| Multilayer | 7–21 days | |
| Production | First order | 5–12 days |
| Ongoing order | 3–10 days |
Need something outside these specs?
Tell us what your design needs. We specialize in meeting complex requirements.