Listed below are FPCexpress standard materials and specifications for Flexible Printed Circuits (FPC). These serve only as guidelines. Contact FPCexpress for special flex circuit materials, tighter tolerances, and any other exceptions that arise in your application.
MATERIALS
This table lists the standard flex circuits materials and material thicknesses that FPCexpress may have daily available. If the material or thickness you require is not listed, consult FPCexpress. We have full specification of each material available for your required.
Material Function | Material Type | Options |
Flexible Insulator | Polyimide (PI) | ½ mil to 5 mil |
|
Conductor | Copper * Rolled Annealed (RA) * Electrodeposited (ED) | ¼ oz. (0.009 mm) to 10 oz. (0.356 mm) |
Rigid Substrate (Rigid-Flex) | FR-4 | 3 mil to 125 mil |
Adhesive | Acrylic Adhesive | ½ mil to 3 mil |
Adhesiveless Materials also available. |
Stiffener | FR-4 Polyimide (PI) Polyester (PET) Adhesive Tape Steel / Aluminium / Copper | 3 mil to 125 mil ½ mil to 5 mil 1 mil to 15 mil 6 mil |
Solder Mask | Polyimide Photoimageable Coverlay Liquid Photoimageable Covercoat | ½ mil to 5 mil 1 mil to 2.5 mil Liquid Typically for Surface Mount and Dense applications |
Surface Finish Options | Tin | Immersion Tin |
Gold | Electroless Nickel Immersion Gold Electrolytic Hard Nickel/Gold Electrolytic Soft Nickel/Gold |
Silver | Immersion |
OSP | Organic Solderability Preservative |
Shielding | Solid Copper Crosshatched Copper Conductive Silver Aluminium | Required to Limit Electromagnetic and/or Electrostatic. |
CAPABILITIES AND PHYSICAL PROPERTIES
Layers (Max) | Up to 8 Layers |
Board Size (Max) | Up to 500 mm x 1000 mm |
Outline Tolerance | a. +/- 0.2 mm Hand Trim b. +/- 0.25 mm Steel Rule Dies c. +/- 0.07 mm Punch and Die d. +/- 0.025 mm Laser Cut |
Hole | Diameter (Min) | 0.1 mm (Finished) |
Diameter Tolerance | a. Plating Through Holes
+/- 0.08 mm b. Non-Plating Through Holes
+/- 0.05 mm |
Drill Position Tolerance | +/- 0.076 mm |
Conductor | Width (Min) |
1.5 mil |
Width Tolerance | +/- 15% |
Spacing (Min) | 2 mil |
Spacing Tolerance | +/- 15% |
Pad | Pad (Non-Wiring) | ≥ 0.4 mm + Hole |
Pad (Wiring) | ≥ 0.3 mm + Hole |
Coverlay | Distance from Holes in Coverlay to Conductors and/or borders (Min) | ≥ 0.13 mm |
Coverlay to Pad (Min) | 100 um |
Coverlay to Conductor (Min) | 100 um |
Coverlay Width (Min) | 250 um |
Stiffener holes | ≥ 0.25 mm + Access Hole |
